New York: Wiley; 2001. Competing interests The RG-7388 order authors declare that they have no competing interests. Authors’ contributions KRK and EFN carried out the experiments and contributed to the data analysis. JRH coordinated the study and helped analyze the data. All authors helped draft the manuscript and approved its final form.”
“Background Resistive random access memory (RRAM) is the most promising candidate for the next-generation nonvolatile memory technology due to its simple structure, excellent scalability potential (<10 nm), long endurance, high speed of operation, and complementary metal-oxide-semiconductor (CMOS) process compatibility [1–7]. RRAM
in cross-point architecture, in which top and bottom electrodes are placed at right angle to each other, is very attractive as it offers high-density integration with 4 F 2, F being the minimum feature Adavosertib molecular weight size area; three-dimensional (3D) stacking; and cost-effective fabrication [8, 9]. Switching GDC0068 uniformity is one of the important properties which require practical realization of cross-point devices with large array size. So it is necessary to investigate the factors affecting switching uniformity. Various binary transition metal oxides such as HfO x [5, 6, 10–12], TiO x [13, 14], TaO x [2, 7, 15–18], AlO x [19–21], ZrO x [22–24], WO x , etc. as a switching material are reported for RRAM application.
Among them, recently, TaO x has attracted much attention  owing to its superior material and switching properties such as having ID-8 two stable phases , high thermal stability , small difference between the free energies of low and high resistance states , CMOS compatibility, long endurance , and high switching speed . So far,a cross-point resistive switching memory device in an Ir/TaO x /W structure has not yet been reported. In this study, self-compliance-limited and low-voltage-operated resistive switching behaviors with improved switching cycle uniformity in a simple resistive memory stack of Ir/TaO x /W in cross-point architecture are reported. The physical properties of switching stack and bottom
electrode morphology have been observed by transmission electron microscope (TEM) and atomic force microscope (AFM) analyses. The improvement is due to the defective switching layer formation as well as the electric field enhancement at the nanotips observed in the bottom electrode surface which results in controlled and uniform filament formation/rupture. The self-compliance property shows the built-in capability of the device to minimize the current overshoot during switching in one resistance (1R) configuration. The device has shown an alternating current (ac) endurance of >105 cycles and a data retention of >104 s. Methods A cross-point resistive memory stack in an Ir/TaO x /W structure have been fabricated on SiO2 (200 nm)/Si substrate. The fabrication steps are schematically depicted in Figure 1.